Last year, Huawei’s Hisilicon managed to beat everyone else to launch the world’s initial 7nm SoC, the Kirin 980. It appears to be as the company will continue the trend of releasing its new-gen chip before others, with its Kirin 985 slated to go into mass production in Q2 2019.
The report from Commerical Times (via Digitimes) states that TSMC is readying its 7nm EUV (Extreme Ultraviolet Lithography) process technology, dubbed like the N7+, for the mass production of Hisilicon’s new generation Kirin 985. Despite the issues associated with developing EUV, it will make the manufacturing process at 7nm, inexpensive and faster.
Soon whenever kicking off number production of Kirin 985, TSMC will start manufacturing Apple’s A13 chipsets by the close of Q2 2019. The Cupertino giant’s chipset will be based on a a bit alternative technology, dubbed like the N7 Pro. All we know about the ‘Pro’ process is that it’s an enhanced variant of the N7+.
This news is in line with a previous report which stated 7nm EUV process for Kirin 985. Since the new technical will speed up the manufacturing process of the chipset, Huawei must be able to ship more telephones with this flagship cpu inside. It’s important for the manufacturer to make certain a steady deliver of its top-end telephones since it plans to ship above 250 million units by the end of 2019.