Redmi, the year-old subbrand of Xiaomi will be announcing its upcoming flagship smartphone Redmi K30 Pro on March 24 in China. Ever due to the fact the brand revealed the release date, it has been teasing the technical specs of the handset for a some days currently.
Continuing the trend, the brand’s General Manager Lu Weibing today unfolded that the up coming Redmi K30 Pro will cram in up to 61 components per square centimeter in its chassis.
A couple of days back, Mr. Lu explained the difficulties involved in implementing pop-up digital camera design in 5G phones. He said that 5G parts require far more space and thus manufacturers have been avoiding pop-up digital cameras lately in 5G devices with Redmi K30 Pro being an exception. He Additionally added that 5G smartphones need a bigger battery and improved thermal performance, what Sad to say cannot be achieved by dividing the motherboard into two sections – a common design in phones with pop-up digital cameras.
Hence Redmi K30 Pro opted for a varied prepare that compelled the brand to adopt the now-common sandwich (stacked) motherboard design unveield in flagship phones like its parent company’s Mi 10 Pro. Like per Mr. Lu, the gadget will cram in up to 61 components per square centimeter by stacking up one motherboard more than additional. He Furthermore said that the cameraphone will include 3885 parts, which is 268% much more than that of last year’s Redmi K20 Pro.
He also confirmed that the pop-up camera will pop in / out within 0.58 seconds, thanks to the fresh stepper motor with a speed of 14.2mm per second, up from 11.5mm per second of its predecessor. That means, it will be 27% faster than the last generation and hence will retract quicker than prior during accidental falls.