The Sd 845 is not even announced and the rumor mill has started on the successor chipset for it. Reliable leakster Roland Quandt has managed to unearth to few information on the Sd 855 through the Linkedin profile of a Qualcomm software engineer called George Fang.
Fang’s profile has revealed that the Sd 845 that has a description of “a complex SoC of a most recent mobile processor (SDM 845) owned by Qualcomm” carries a codename of Napali v2.0. Gossips have unveiled that it is the second-generation 10nm chipset in Qualcomm.
It is interesting to know that Qualcomm might have presently started working on Sd 855 chipset as Fang’s Linkedin profile describes it as “a most recent cpu (SDM855 series) owned by Qualcomm” and it is codenamed as Hana v1.0. Gossips have it that it is 7nm chipset that will be powering flagship smartphones in 2019.
Speculations have it that TSMC will be manufacturing the 7nm Sd 855, and not Samsung. A Chinese leakster has revealed that it is low energy consuming chipset and the phones that will be powering will function ultrasonic fingerprint camera sensor under the show. The SoC is In addition guessed to deliver 30 to 40 percent much better experience than SD 845. It is Furthermore expected to carry AI capabilities.